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MAX5091 Datasheet(PDF) 2 Page - Maxim Integrated Products |
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MAX5091 Datasheet(HTML) 2 Page - Maxim Integrated Products |
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2 / 15 page ![]() 28V, 100mA, Low-Quiescent-Current LDO with Reset and Power-Fail Input/Output 2 _______________________________________________________________________________________ ABSOLUTE MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS (MAX5091A) (VS = +14V, VOUT = 5V, EN unconnected, TA = TJ = -40°C to +125°C, CIN = 10µF, COUT = 10µF, unless otherwise noted. Typical specifications are at TA = +25°C.) (Note 1) Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. VS to GND ..............................................................-0.3V to +28V VS to GND (t ≤ 1s) ..................................................-0.3V to +40V VOUT to GND ..........................................................-0.3V to +20V VS to OUT ...............................................................-0.3V to +28V RES, SO to GND.....................................................-0.3V to +20V RES, SO Output Sink Current................................................5mA VOUT Short Circuit (VS ≤ 16V)…………......................Continuous EN, SI to GND.........................................................-0.3V to +12V CT to GND.............................-0.3V to the lower of VOUT or +12V Continuous Power Dissipation (TA = +70°C) 8-Pin SO-EP (derate 19.2mW/°C above +70°C) .........1538mW* Thermal Resistance ( θJA)................................................52°C/W Thermal Resistance ( θJC)..................................................6°C/W 8-Pin TDFN-EP (derate 24.4mW/°C above +70°C).....1951mW** Thermal Resistance ( θJA)................................................41°C/W Thermal Resistance ( θJC)...............................................8.3°C/W Operating Junction Temperature Range ...........-40°C to +125°C Maximum Junction Temperature .....................................+150°C Storage Temperature Range .............................-60°C to +150°C Lead Temperature (soldering, 10s) .................................+300°C PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS TA = +25°C, IOUT = 1mA 4.95 5 5.05 5.6V ≤ VS ≤ 28V, IOUT = 1mA to 50mA (Note 2) 4.90 5 5.10 5.6V ≤ VS ≤ 40V, t ≤ 1s, IOUT = 1mA to 30mA (Note 2) 4.9 5 5.1 Output Voltage VOUT VS = +8V, IOUT = 1mA to 100mA 4.9 5 5.1 V IOUT = 10mA 0.1 0.25 IOUT = 50mA 0.2 0.4 Dropout Voltage VDP VS = +4.75V IOUT = 100mA 0.3 0.5 V VS to VOUT Difference in Undervoltage VIO VS = +4V, IOUT = 35mA 0.4 V Line Regulation VOL +5.5V ≤ VS ≤ +28V, IOUT = 1mA 0.6 5 mV Load Regulation VOLO 1mA ≤ IOUT ≤ 100mA 17 50 mV Current Limit ILIM 160 260 400 mA IOUT = 100µA 46 100 IOUT = 300µA 45 100 µA Quiescent Current IQ IOUT = 100mA 4.5 10 mA Shutdown Supply Current ISHDN VEN ≤ +0.4V 17 30 µA Thermal-Shutdown Temperature TJ(SHDN) Temperature rising +165 °C Thermal-Shutdown Hysteresis ΔTJ(SHDN) 20 °C *As per JEDEC51 Standard (single-layer board). **As per JEDEC51 Standard (multilayer board). |
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