The Embedded I/O Company

Technical Information

 Form Factor: PICMG AMC.0 R2.0 Module

 Board size: single Mid-Size or Full-Size AMC

 AMC port 0 – 11 connected to FPGA MGTs

 on-board AC-coupling for Rx and Tx

 port speed up to 3.2Gb/sec (6.5Gb/s for FX)

 AMC port 12 – 15 & 17 connected to FPGA I/Os

 on-board AC-coupling for Rx and Tx

 port speed up to 1.0Gb/sec

 TCLKA – TCLKD support

 Virtex-5 FPGA with integrated PCIe Endpoint Block

 XC5VLX110T or XC5VLX155T

 XC5VSX95T

 XC5VFX70T or XC5VFX100T

 2 x QDR-II SRAM bank, 1M x18 (2 MB) each

 2 x DDR2 SDRAM bank, 64 M x32 (256 MB) each

 IPMI V1.5 support

 Front panel LEDs:

 Blue Hot Swap LED

 Red FAIL LED (LED1)

 Green USER / Power Good LED (LED2)

 Vita57.1 FMC Slot (high pin count)

 160 single ended I/Os or 80 differential

 x4 Multi-Gigabit Link to FMC

 VADJ = 1.2 – 3.3 Volt

 Operating temperature 0°C to +70°C

 MTBF (MIL-HDBK217F/FN2 GB 20°C)

TAMC641: 304000 h

TEWS TECHNOLOGIES GmbH keeps the right to change technical specification without further notice.

All trademarks mentioned are property of their respective owners.

Issue 1.0.0

2013-11-14

TEWS TECHNOLOGIES GmbH

Am Bahnhof 7

25469 Halstenbek, Germany

Phone: +49 (0) 4101 4058 0

Fax: +49 (0) 4101 4058 19

e-mail: info@tews.com

www.tews.com