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ES4810FAA Datasheet(PDF) 2 Page - ESS Technology,Inc |
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ES4810FAA Datasheet(HTML) 2 Page - ESS Technology,Inc |
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2 / 4 page ![]() 2 SAM0660-080406 ESS Technology, Inc. ES4810SAA PRODUCT BRIEF MECHANICAL DIMENSIONS PRELIMINARY MECHANICAL DIMENSIONS The mechanical dimensions for the ES4810 are shown in Figure 2. Figure 2 208-pin Low-profile Quad Flat Package (LQFP) Symbol Descriptions Millimeters Minimum Nominal Maximum D Lead to lead, X-axis 29.85 30.00 30.15 D1 Package’s outside, X-axis 27.90 28.00 28.10 D2 Exposed pad, X-axis — 7.0 (1) — E Lead to lead, Y-axis 29.85 30.00 30.15 E1 Package’s outside, Y-axis 27.90 28.00 28.10 E2 Exposed pad, Y-axis — 7.0 (1) — A1 Board standoff 0.05 0.10 0.15 A2 Package thickness 1.35 1.40 1.45 b Lead width 0.17 0.22 0.27 e Lead pitch (center to center) — 0.50 — e1 Lead gap 0.23 0.28 0.33 L Foot length 0.45 0.60 0.75 L1 Lead length 0.90 1.00 1.10 — Foot angle 0° — 7° — Coplanarity — — 0.102 — Number of leads in X-axis — 52 — — Number of leads in Y-axis — 52 — — Total number of leads — 208 — — Package type — LQFP — (1) Depending on the assembly house, the D2 and E2 dimensions may vary slightly. For lead-free devices, the solder paste and PCB finish/plating must be 100% lead free in order to ensure proper solderability. E1 A2 A1 L E D1 b D e 1 e1 L1 E2 D2 |
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