CF5018 series

SEIKO NPC CORPORATION —2

PAD LAYOUT

(Unit:

µm)

PIN DESCRIPTION and PAD DIMENSIONS

BLOCK DIAGRAM

Chip size: 0.72

× 0.73mm

Chip thickness: 220 ± 30µm

PAD size: 90µm

Name

I/O

Description

Pad dimensions [µm]

XY

INHN

I

Output state control input. High impedance when LOW (oscillator stops).

Power-saving pull-up resistor built-in.

151

277

XT

I

Amplifier input

Crystal connection pins.

Crystal is connected between XT and XTN.

238

131

XTN

O

Amplifier output

503

131

VSS

–

Ground

588

345

Q

O

Output. Output frequency. High impedance in standby mode

588

598

VDD

–

Supply voltage

131

598

INHN = LOW active

Q

VDD

XTN

VSS

(0,0)

(720,730)

X

Y

INHN

XT

NPC

XT

VSS

VDD

Q

XTN

INHN