CF5029A

SEIKO NPC CORPORATION —2

PAD LAYOUT

(Unit:

µm)

PIN DESCRIPTION and PAD DIMENSIONS

BLOCK DIAGRAM

Chip size: 1.00

× 1.06mm

Chip thickness: 220 ± 30µm

PAD size: 100µm

No.

Name

I/O

Description

Pad dimensions [µm]

XY

1

INHN

I

Output state control input. High impedance when LOW, oscillator stops.

Power-saving pull-up resistor built-in.

155

785

2

XT

I

Oscillator input

Crystal connection pins.

Crystal is connected between XT and XTN.

155

597

3

XTN

O

Oscillator output

155

363

4

VSS

–

(–) ground

155

175

5

NC

–

No connection (leave open)

844

175

6

Q

O

Output. Source oscillator divided-by-512 frequency output

844

363

7

NC

–

No connection (leave open)

844

694

8

VDD

–

(+) supply voltage

844

882

(0,0)

(1000,1060)

X

Y

1

INHN

VSS

2

3

45

6

7

VDD

Q

8

XT

XTN

NC

NC

NPC

XT

VSS

VDD

Q

XTN

INHN

1

512