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WF5027AS-4 Datasheet(PDF) 3 Page - Nippon Precision Circuits Inc

Part # WF5027AS-4
Description  Crystal Oscillator Module ICs
PDF  21 Pages
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Manufacturer  NPC [Nippon Precision Circuits Inc]
Direct Link  http://www.npc.co.jp/en
Logo NPC - Nippon Precision Circuits Inc

WF5027AS-4 Datasheet(HTML) 3 Page - Nippon Precision Circuits Inc

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WF5027 series
SEIKO NPC CORPORATION —3
PAD LAYOUT
(Unit:
µm)
PAD DIMENSIONS
PIN DESCRIPTION
BLOCK DIAGRAM
I
5027A
×, M×, Q×
(for Flip Chip Bonding)
I
5027B
×, N×, R×
(for Wire Bonding (type I))
I
5027C
×, P×, S×
(for Wire Bonding (type II))
Chip size: 0.75
× 0.69mm
Chip thickness: 130 ± 15µm
PAD size: 90µm
Chip base: VSS level
Chip size: 0.75
× 0.69mm
Chip thickness: 130 ± 15µm
PAD size: 90µm
Chip base: VSS level
Chip size: 0.75
× 0.69mm
Chip thickness: 130 ± 15µm
PAD size: 90µm
Chip base: VSS level
Pad No.
Pad dimensions [µm]
Pad No.
Pin
Name
Description
XY
5027A
×
5027M
×
5027Q
×
5027B
×
5027N
×
5027R
×
5027C
×
5027P
×
5027S
×
1
229
114
1
2
1
XT
Amplifier input
Crystal connection pins. Crystal is connected
between XT and XTN.
2
520
114
2
1
2
XTN
Amplifier output
3
636
304
3
6
5
VDD
(+) supply voltage
–
4
636
531
4
5
4
Q
Output
Output frequency determined by internal circuit
to one of fO, fO/2, fO/4, fO/8, fO/16, fO/32, fO/64
5
114
531
5
4
3
VSS
(–) ground
–
6
114
304
6
3
6
INHN
Output state
control input
High impedance when LOW (oscillator stops).
Power-saving pull-up resistor built-in.
Q
VDD
XTN
VSS
(0,0)
(750,690)
X
Y
INHN
XT
12
3
4
6
5
VSS
INHN
XT
Q
(0,0)
(750,690)
X
Y
VDD
XTN
12
3
4
6
5
Q
VSS
XTN
VDD
(0,0)
(750,690)
X
Y
INHN
XT
12
3
4
6
5
XT
INHN
XTN
Q
CMOS
RD
CG
VSS
VDD
CD
RF
VRG
DIVIDER



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