CMC01

2006-11-06

1

TOSHIBA RECTIFIER SILICON DIFFUSED TYPE

CMC01

For Strobe Discharge Circuit

• Repetitive peak reverse voltage

• : VRRM = 400 V

Small surface-mount package

Characteristics

Symbol

Rating

Unit

Repetitive peak reverse voltage

400

V

Average forward current (Note 1)

1.0(Ta=47°C)

A

Peak one cycle surge forward current

(non-repetitive)

30 (50 Hz)

A

Repetitive peak forward current

(Note 2)

150

A

Junction temperature

-40～150

°C

Storage temperature range

-40～150

°C

Note 1: Device mounted on a glass-epoxy board

board size: 50 mm

× 50 mm

soldering land: 6 mm

×6 mm

glass-epoxy board thickness 1.6t

Note 3: Using continuously under heavy loads (e.g. the application of

high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to

decrease in the reliability significantly even if the operating conditions (i.e. operating

temperature/current/voltage, etc.) are within the absolute maximum ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Characteristics

Symbol

Test Condition

Min

Typ.

Max

Unit

Peak forward voltage

⎯

0.86

1.0

V

Repetitive peak reverse current

⎯

⎯

10

μA

Device mounted on a ceramic board

Board size:

50 mm

× 50 mm

Soldering land: 2 mm

× 2 mm

Ceramic board thickness: 0.64t

⎯

⎯

60

Device mounted on a glass-epoxy

board

Board size: 50 mm

× 50 mm

Soldering land: 6 mm

× 6 mm

glass-epoxy board thickness: 1.6t

⎯

⎯

110

Device mounted on a glass-epoxy

board

Board size: 50 mm

× 50 mm

Soldering land: 2.1 mm

× 1.4 mm

glass-epoxy board thickness: 1.6t

⎯

⎯

180

°C/W

Thermal resistance

―

⎯

⎯

16

°C/W

Unit: mm

JEDEC

―

JEITA

―

TOSHIBA

3-4E1A

Weight: 0.023 g (typ.)