CMF01

2006-11-07

2

Characteristic

Symbol

Test Condition

Min

Typ.

Max

Unit

Peak forward voltage

⎯

1.4

2.0

V

Repetitive peak reverse current

⎯

⎯

50

μA

Reverse recovery time

trr

⎯

⎯

100

ns

Forward recovery time

tfr

⎯

270

⎯

ns

Device mounted on a ceramic board

(board size: 50 mm

× 50 mm)

(soldering land: 2 mm

× 2 mm)

(board thickness: 0.64 t)

⎯

⎯

60

Device mounted on a glass-epoxy

board

(board size: 50 mm

× 50 mm)

(soldering land: 6 mm

× 6 mm)

(board thickness: 1.6 t)

⎯

⎯

135

Thermal resistance

Device mounted on a glass-epoxy

board

(board size: 50 mm

× 50 mm)

(soldering land: 2.1 mm

× 1.4 mm)

(board thickness: 1.6 t)

⎯

⎯

210

°C/W

Thermal resistance (junction to lead)

⎯

⎯

⎯

16

°C/W

Marking

Standard Soldering Pad

Abbreviation Code

Part No.

F1

CMF01

Handling Precautions

The absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be exceeded

during operation, even for an instant. The following are the general derating methods we recommend for designing a

circuit using this device.

designing a device for use at low temperature.

Carry out sufficient heat design. If it is not possible to design a circuit with excellent heat radiation, set a margin by

using an allowable Tamax-IF (AV) curve.

This rating specifies the non-repetitive peak current in one cycle of a 50 Hz sine wave, condition angle 180

°. Therefore

the rating applies only to abnormal operation, which seldom occurs during the lifespan of a device.

For this device, we recommend a Tj of below 120℃ under the worst load and heat radiation conditions.

Thermal resistance between junction and ambient fluctuates depending on the mounting condition of the device. When

using the device, be sure to design the circuit board and soldering land size to match the appropriate thermal resistance

value.

Refer to the Rectifier databook for further information.

3.0

1.4

Unit: mm

1.4