VDD to GND .........................................................-0.3V to +6.0V

RS+, RS- to GND..................................................-0.3V to +80V

RS+ to RS- ..........................................................................±30V

Continuous Input Current (Any Pin) .................................±20mA

Continuous Power Dissipation (TA = +70°C)

WLP (derate 13.4mW/°C above +70°C) ....................1072mW

µMAX (derate 4.8mW/°C above +70°C)...................387.8mW

Operating Temperature Range......................... -40°C to +125°C

Junction Temperature......................................................+150°C

Storage Temperature Range............................ -65°C to +150°C

Lead Temperature (soldering, 10s)(µMAX only) .............+300°C

Soldering Temperature (reflow).......................................+260°C

WLP

Junction-to-Ambient Thermal Resistance (θJA) .......74.7°C/W

µMAX

Junction-to-Ambient Thermal Resistance (θJA) .....206.3°C/W

Junction-to-Case Thermal Resistance (θJC)...............42°C/W

(VRS+ = VRS- = +50V, VDD = +3.3V, VSENSE = VRS+ - VRS- = 1mV, TA = -40°C to +125°C, unless otherwise noted. Typical values are

at TA =+25°C.) (Note 2)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

DC CHARACTERISTICS

Supply Voltage

VDD

Guaranteed by PSRR

2.7

5.5

V

Supply Current

(Both Channels)

IDD

No loads

1.3

2.1

mA

Power-Supply Rejection

Ratio

PSRR

2.7V ≤ VDD ≤ 5.5V

110

dB

Input Common-Mode

Voltage Range

VCM

Guaranteed by CMRR

0

76

V

Input Bias Current at

VRS+ and VRS-

IRS+, IRS-

0.2

µA

Input Offset Current

IRS+ - IRS-

0.2

µA

Input Leakage Current

IRS+, IRS-

VDD = 0V, VRS+ = 76V

0.2

µA

Common-Mode Rejection

Ratio

CMRR

0V < VRS+ < 76V

130

dB

Input Offset Voltage

VOS

µMAX

TA = +25°C, 0 < VCM < 76V

0.5

±12

µV

-40°C ≤ TA ≤ +125°C,

0 < VCM < 76V

±25

WLP

TA = +25°C, 0 < VCM < 76V

±20

-40°C ≤ TA ≤ +125°C,

0 < VCM < 76V

±33

Input Offset Voltage Drift

TCVOS

130

nV/°C

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to

www.maximintegrated.com/thermal-tutorial.

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

(Note 1)

Package Thermal Characteristics

Electrical Characteristics

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Analog Devices │ 2

MAX40201

Dual-Channel, 0V to 76V Current-Sense Amplifier