HCT8 Series High Clearance and Creepage Transformer

Reflow Solder Profile

TP

TP

tp

ts

TTO

RAMP-UP

L

TL

t L

TMAX.

S

TMIN.

25 °C

PREHEAT

S

Time

CRITICAL ZONE

RAMP-DOWN

t 25 °C TO PEAK

Profile Feature

Pb-Free Assembly

Average Ramp-Up Rate

3 °C / second max�

PREHEAT:

Temperature Min� (Tsmin)

Temperature Max� (Tsmax)

Time (Tsmin to Tsmax)

150 °C

200 °C

60~180 seconds

Liquidus Temperature (TL)

217 °C

Time Above Liquidus

Temperature (tL)

60~150 seconds

Peak Temperature (Tp)

240-245 °C

Time within 5 °C of Actual Peak

Temperature (tp)

20~40 seconds

Ramp-Down Rate from Peak

Temperature

6 °C / second max�

Time 25 °C to Peak Temperature

(Tp)

8 minutes max�

Do Not Exceed

245 °C

Specifications are subject to change without notice.

Users should verify actual device performance in their specific applications.

The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.

Electrical Schematic

PRIMARY

SECONDARY

POLARITY

1

2

3

6

5

4

Packaging Specifications

Tape & Reel����������� 400 pcs�/13-inch reel

How To Order

HCT8xxxxE A L - E

Model

AEC-Q200 Compliancy Designator

RoHS Compliancy Designator

Packaging

E = 400 pcs� per 13-inch Reel