TB6552FN/FNG/FL/FLG

2007-4-2

9

Requests Concerning Use of QON

Outline Drawing of Package

When using QON, take into account the following items.

Caution

(1)

Do not carry out soldering on the island sections in the four corners of the package (indicated by the

hatched sections in the figure for the lower surface, above left) with the aim of increasing mechanical

strength.

(2)

The projecting island sections on the package surfaces (indicated by the hatched sections in the

figures for the upper and lower surfaces above) must be electrically insulated from outside when used.

Note 6: Ensure that the island sections (indicated by the hatched sections in the figure for the lower

surface, above left) do not come into contact with solder from through-holes on the board layout.

• When mounting or soldering, take care to ensure that neither static electricity nor electrical

overstress is applied to the IC. (Measures to prevent electrostatic discharge, leaks, etc.)

• When incorporating the IC into a set, adopt a set design that does not apply voltage directly to the

island section.

Upper surface

Lower surface