CSD Series Datasheet

1

2

Type

CSD842

CSD851

CSD853

Endurance

IEC60115-1 clause 4.25

(P70 @ 70[ºC], 1000[h])

±[%]

1,0

Short Time Overload

(U=5 *

, 5[s]

±[%]

1,0

Resistance to Soldering Heat

IEC60115-1 clause 4.18 and Mil-STD-202 Method 210

(260[°C], 10[s])

±[%]

0,5

Low Temperature Storage

-65[ºC] 24[H]

±[%]

0,2

High Temperature Exposure

Mil-STD-202 Method 108

+170[ºC] 1000[H]

±[%]

1,0

Rapid change of temperature

IEC60115-1 clause 4.19 and IEC60068-2-14

(30 [min] -55 [ºC] and 30 [min] +150 [ºC])

±[%]

0,5

Biased Humidity

MIL-STD-202 Method 103

(85[ºC], 85[%RH] 1.000[h])

±[%]

0,5

Vibrations

Mil-STD-202 Method 204

(10 to 2000 [Hz], 5 [G] for 20 [min], 12 cycles, each of 3 orientation

±[%]

0,2

Mechanical Shock

Mil-STD-202 Method 213

(100 [G] for 6[ms] , Half sine)

±[%]

0,2

Solderability

IEC60068-2-20 and J-STD-002

Solder bath method (> 95% coverage)

Marking

IEC60062

Value imprinted

Stability Deviation

*

Tt = Terminal Temperature

±[%]

< 0.5 after 2000 Hours, * Tt = 110ºC

< 1.0 after 2000 Hours, * Tt = 140ºC

Power Derating Curve

Resistance Change vs Temperature

[Copper Manganese 43 Alloy]

Resistance Change vs Temperature

[Aluchrom A1 Alloy]