CSM Series Datasheet

1

2

Type

CSM381

CSM452

Short Time Overload

(U=5 *

,

5[s]

±[%]

1

Resistance to Soldering Heat

IEC60115-1 clause 4.18 and Mil-STD-202 Method 210

(260[°C], 10[s])

±[%]

0,5

Low Temperature Storage

-65[ºC] 24[H]

±[%]

0,2

High Temperature Exposure

Mil-STD-202 Method 108

+170[ºC] 1000[H]

±[%]

2

Rapid change of temperature

IEC60115-1 clause 4.19 and IEC60068-2-14

(30 [min] -55 [ºC] and 30 [min] +150 [ºC])

±[%]

0,5

Biased Humidity

MIL-STD-202 Method 103

(85[ºC], 85[%RH] 1.000[h])

±[%]

0,5

Vibrations

Mil-STD-202 Method 204

(10 to 2000 [Hz], 5 [G] for 20 [min], 12 cycles, each of 3 orientation

±[%]

0,2

Mechanical Shock

Mil-STD-202 Method 213

( 100 [G] for 6[ms], Half sine)

±[%]

0,2

Solderability

IEC60068-2-20 and J-STD-002

Solder bath method (> 95% coverage)

Stability deviation

* Tt = Terminal Temperature

±[%]

< 0.5 after 2000 Hours

* Tt = 110ºC

< 1.0 after 2000 Hours

* Tt = 140ºC

Marking

IEC60062

Printed value

Type

Value

[mΩ]

Resistance

values

Thickness

t

TCR

[ppm]

P

[W]

Material

CSM452

1

R001

0,74

< 100

5

Copper Nickel Alloy

2

R002

0,60

2L5

R0025

0,48

5

R005

0,24

10

R01

0,35

NiCr Alloy

15

R015

0,23

Aluchrom Alloy

20

R02

0,175

25

R025

0,14

NiCr Alloy

Type

Value

[mΩ]

Resistance

values

Thickness

t

TCR

[ppm]

P

[W]

Material

CSM381

2

R002

0,74

< 100

2

Copper Manganese Alloy

4

R004

0,60

5

R005

0,48

10

R01

0,24

20

R02

0,35

NiCr Alloy

30

R03

0,23

Aluchrom Alloy

40

R04

0,175

50

R05

0,13

NiCr Alloy