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ADL6332ACCZB-R7 Datasheet(PDF) 9 Page - Analog Devices

Part # ADL6332ACCZB-R7
Description  0.38 GHz to 15 GHz RxVGA
PDF  55 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

ADL6332ACCZB-R7 Datasheet(HTML) 9 Page - Analog Devices

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Data Sheet
ADL6332
ABSOLUTE MAXIMUM RATINGS
analog.com
Rev. A | 9 of 55
Table 4. Absolute Maximum Ratings
Parameter
Rating
V33AMP1, V33AMP1A, V33AMP2, V33AMP2A,
V33FUSE
−0.3 V to +3.6 V
RFIN
10 dBm
SCLK, SDO, SDIO, CSB, CA0, CA1, CA2, ENP,
ATTSEL0, ATTSEL1
−0.3 V to +3.6 V
Maximum Junction Temperature
125°C
Operating Temperature Range (Measured at the
Exposed Pad)
−40°C to +105°C
Storage Temperature Range
−65°C to +150°C
Stresses at or above those listed under Absolute Maximum Ratings
may cause permanent damage to the product. This is a stress
rating only; functional operation of the product at these or any other
conditions above those indicated in the operational section of this
specification is not implied. Operation beyond the maximum operat-
ing conditions for extended periods may affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to PCB
thermal design is required.
θJC is the conduction thermal resistance from junction to case,
where the case temperature is measured at the bottom of the
package.
The thermal resistance value specified in Table 5 is simulated
based on JEDEC specifications (unless specified otherwise) and
must be used in compliance with JESD51-12.
Table 5. Thermal Resistance
Package Type
θJC
Unit
CC-24-17
9.6
°C/W
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Charged devi-
ces and circuit boards can discharge without detection. Although
this product features patented or proprietary protection circuitry,
damage may occur on devices subjected to high energy ESD.
Therefore, proper ESD precautions should be taken to avoid
performance degradation or loss of functionality.



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