BMP384 datasheet(51/58 Pages) BOSCH

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Bosch Sensortec | BMP384 Datasheet

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Modifications reserved |Data subject not change without notice | Printed in Germany

Document number: BST-BMP384-DS003-11 Revision_1.0_112020

7.4.

Soldering guidelines

The moisture sensitivity level of the BMP384 sensors corresponds to JEDEC Level 3, see also:

•

IPC/JEDEC J-STD-020E “Joint Industry Standard: Moisture/Reflow Sensitivity Classification for non-hermetic Solid

State Surface Mount Devices”

•

IPC/JEDEC J-STD-033D “Joint Industry Standard: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive

Surface Mount Devices”.

BMP384 sensors being covered by a dry package should be used within 7 days after opening the package/exposure to the

environment.

The sensor fulfils the lead-free soldering requirements of the above-mentioned IPC/JEDEC standard, i.e. reflow soldering

with a peak temperature up to 260°C. The minimum height of the solder after reflow shall be at least 20 µm. This is required

for good mechanical decoupling between the sensor device and the printed circuit board (PCB).

Figure 27: Soldering profile

BMP384 Datasheet(PDF) 51 Page - Bosch Sensortec GmbH