BAT54H

Taiwan Semiconductor

2

Version: A2501

THERMAL PERFORMANCE

PARAMETER

SYMBOL

TYP

UNIT

Junction-to-ambient thermal resistance(1)

RӨJA

500

°C/W

Thermal Performance Note:

1.

Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint

ELECTRICAL SPECIFICATIONS (T

A

= 25°C unless otherwise noted)

PARAMETER

CONDITIONS

SYMBOL

MIN

TYP

MAX

UNIT

Forward voltage(1)

IF = 0.1mA

VF

-

-

240

mV

IF = 1mA

-

-

320

IF = 10mA

-

-

400

IF = 30mA

-

-

500

IF = 100mA

-

-

800

Reverse breakdown voltage

IR

= 100μA

VBR

30

-

-

V

Reverse current(2)

VR = 25V

IR

-

-

2

μA

Junction capacitance

f = 1MHz, VR = 1V

CJ

-

-

10

pF

Reverse recovery time

IF = IR = 10mA,

IRR = 1mA, RL =

100Ω

trr

-

-

5

ns

Notes:

1.

Pulse test with PW=0.3 ms

2.

Pulse test with PW=30 ms

ORDERING INFORMATION

ORDERING CODE

PACKAGE

PACKING

BAT54H RFG

SOT-23

3,000 / 7” Tape & Reel