TL(RE,RME,SE,OE,YE,PYE,GE,FGE,PGE)62T(F)

2007-10-01

2

Product Name

Forward Current

Reverse Voltage

Power Dissipation

Operating

Temperature

Storage

Temperature

TLRE62T(F)

50

4

120

TLRME62T(F)

50

4

120

TLSE62T(F)

50

4

120

TLOE62T(F)

50

4

120

TLYE62T(F)

50

4

120

TLPYE62T(F)

50

4

120

TLGE62T(F)

50

4

120

TLFGE62T(F)

50

4

120

TLPGE62T(F)

50

4

120

−40~100

−40~120

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even

if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum

ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Typ. Emission Wavelength

Luminous Intensity

Forward Voltage

Reverse Current

Product Name

Δλ

Min

Typ.

Typ.

Max

Max

TLRE62T(F)

630

(644)

20

20

47.6

120

20

1.9

2.4

20

50

4

TLRME62T(F)

626

(636)

23

20

47.6

180

20

1.9

2.4

20

50

4

TLSE62T(F)

613

(623)

20

20

85

200

20

1.9

2.4

20

50

4

TLOE62T(F)

605

(612)

20

20

153

350

20

2.0

2.4

20

50

4

TLYE62T(F)

587

(590)

17

20

85

250

20

2.0

2.4

20

50

4

TLPYE62T(F)

580

(583)

14

20

47.6

150

20

2.0

2.4

20

50

4

TLGE62T(F)

571

(574)

17

20

47.6

110

20

2.0

2.4

20

50

4

TLFGE62T(F)

565

(568)

15

20

27.2

70

20

2.0

2.4

20

50

4

TLPGE62T(F)

558

(562)

14

20

15.3

45

20

2.1

2.4

20

50

4

Unit

nm

mA

mcd

mA

V

mA

μA

V

Precautions

Please be careful of the following:

• Soldering temperature: 260°C max, soldering time: 3 s max

(soldering portion of lead: up to 1.6 mm from the body of the device)

• If the lead is formed, the lead should be formed up to 1.6 mm from the body of the device without forming stress

to the resin. Soldering should be performed after lead forming.

• This visible LED lamp also emits some IR light.

If a photodetector is located near the LED lamp, please ensure that it will not be affected by this IR light.