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C2F Datasheet(PDF) 3 Page - Bel Fuse Inc.

Part # C2F
Description  Surface Mount Fast Acting Chip Fuse
PDF  4 Pages
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Manufacturer  BEL [Bel Fuse Inc.]
Direct Link  http://www.belfuse.com
Logo BEL - Bel Fuse Inc.

C2F Datasheet(HTML) 3 Page - Bel Fuse Inc.

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Bel Fuse Inc.
300 Executive Drive, Suite 300
West Orange, NJ 07052 USA
+1 201.432.0463
Bel.US.CS@belf.com
belfuse.com/circuit-protection
© 2025 Bel Fuse, Inc.
Rev. C2F Feb2025
Environmental Specifications
High temperature storage
MIL-STD-202 Method 108
Temperature cycling
JESD22 Method JA-104,Test Condition B
Biased humidity
MIL-STD-202 Method 103,85C/85% RH
with 10% operating power for 1000 hrs
Operational life
MIL-STD-202 Method 108, Test Condition
D
Resistance to solvents
MIL-STD-202 Method 215
Mechanical shock
MIL-STD-202 Method 213,Test Condition C
Vibration
MIL-STD-202 Method 204
Resistance to soldering
heat
MIL-STD-202 Method 210,Test condition B
Thermal shock
MIL-STD-202 Method 107
Solderability
J-STD-002
Board flex(SMD)
AEC-Q200-005
Terminal strength
AEC-Q200-006
Electrical characterization
3 temperature electrical
Soldering Parameters
Shock Resistance
MIL-STD-202G, Method 213B, Test Condition
1
(100 G's peak for 6 milliseconds; Sawtooth
waveform)
Vibration Resistance
MIL-STD-202G, Method 201A (10-55 Hz,0.06
inch, total excursion).
Salt Spray Resistance
MIL-STD-202G, Method 101E, Test Condition
B (48 hrs).
Insulation Resistance
MIL-STD-202G, Method 302, Test Condition
A (After Opening) 10,000 ohms minimum.
Solderability
MIL-STD-202G, Method 208H
Resistance to solder
Heat
MIL-STD-202G, Method 210F, Test Condition
C. Top Side(260℃,20 sec)
MIL-STD-202G, Method 210F, Test Condition
D. Bottom Side(260℃,10 sec)
Thermal Shock
MIL-STD-202G, Method 107G, Test Condition
B (-65℃ to +125℃).
Operating
Temperature
-55℃ to +125℃
Moisture Sensitivity
Level
1 (According to IPC J-Std-020)
IR Reflow Profile (IPC/JEDEC J-STD-020D)
Preheat & Soak
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
150℃
200℃
60-120 seconds
Average ramp-up rate (Tsmax to Tp)
3℃/second max.
Liquidous temperature (TL)
Time at liquidous (tL)
217℃
60-150 seconds
Peak temperature (Tp)
260℃ max
Time (tp) within 5℃ of the
specified classification temperture (Tc)
30 seconds
Average ramp-down rate (Tp to Tsmax)
6℃/second max.
Time 25℃ to peak temperature
8 minutes max.
Lead-free Wave Soldering Profile
Wave Soldering Parameter
Average ramp-up rate
200℃ / second
Heating rate during preheat
typical 1 - 2℃ / second
Max 4℃ / second
Final preheat temperature
within 125℃ of soldering
temperature
Peak temperature Tp
260℃
Time within +0℃ / -5℃ of actual
peak temperature
10 seconds
Ramp-down rate
5℃ / second max.
Specifications subject to change without notice



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