TLP106

2007-10-01

2

Recommended Operating Conditions

CHARACTERISTIC

SYMBOL

MIN.

TYP.

MAX.

UNIT

Input Current, ON

IF (ON)

5

―

10

mA

Input Voltage, OFF

VF (OFF)

0

―

0.8

V

Supply Voltage

VCC

4.5

―

20

V

Operating Temperature

Topr

-40

―

85

°C

Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the

device. Additionally, each item is an independent guideline respectively. In developing designs using this

product, please confirm specified characteristics shown in this document.

Absolute Maximum Ratings (Ta = 25°C)

CHARACTERISTIC

SYMBOL

RATING

UNIT

Forward Current

IF

20

mA

Peak Transient Forward Current (Note 1)

IFPT

1

A

Reverse Voltage

VR

5

V

Output Current 1 (Ta ≤ 25

°C)

IO1

15/-15

mA

Output Current 2 (Ta = 85

°C)

IO2

4.5/-4.5

mA

Peak Output Current

IOP

20/-20

mA

Output Voltage

VO

-0.5~20

V

Supply Voltage

VCC

-0.5~20

V

Operating Temperature Range

Topr

-40~85

°C

Storage Temperature Range

Tstg

-55~125

°C

Lead Solder Temperature (10 s)

Tsol

260

°C

Isolation Voltage

(AC, 1 min., R.H. ≤60%,Ta = 25

°C) (Note2)

BVs

3750

Vrms

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even

if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum

ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Note 1: Pulse width PW ≤ 10 us, 500 pps.

Note 2: Product considered a two-terminal device: pins 1 and 3 shorted together and pins 4, 5 and 6 shorted

together.