IRF250

Semelab plc. Telephone (01455) 556565. Telex: 341927. Fax (01455) 552612.

Prelim. 9/96

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

200

0.029

0.085

0.090

24

9

25

250

100

–100

3500

700

110

55

115

822

30

60

35

190

170

130

30

120

1.9

950

9.0

Negligible

5.0

13

0.83

0.12

30

VGS = 0

ID = 1mA

Reference to 25°C

ID = 1mA

VGS = 10V

ID = 19A

VGS = 10V

ID = 30A

VDS = VGS

ID = 250mA

VDS > 15V

ID = 19A

VGS = 0

VDS = 0.8BVDSS

TJ = 125°C

VGS = 20V

VGS = –20V

VGS = 0

VDS = 25V

f = 1MHz

VGS = 10V

ID = 30A

VDS = 0.5BVDSS

VDD = 100V

ID = 30A

RG = 2.35Ω

IS = 30A

TJ = 25°C

VGS = 0

IF = 30A

TJ = 25°C

di / dt ≤ 100A/µsVDD ≤ 50V

ELECTRICAL CHARACTERISTICS (Tcase = 25°C unless otherwise stated)

Drain – Source Breakdown Voltage

Temperature Coefficient of

Breakdown Voltage

Static Drain – Source On–State

Resistance 1

Gate Threshold Voltage

Forward Transconductance 1

Zero Gate Voltage Drain Current

Forward Gate – Source Leakage

Reverse Gate – Source Leakage

Input Capacitance

Output Capacitance

Reverse Transfer Capacitance

Total Gate Charge

Gate – Source Charge

Gate – Drain (“Miller”) Charge

Turn–On Delay Time

Rise Time

Turn–Off Delay Time

Fall Time

Continuous Source Current

Pulse Source Current 2

Diode Forward Voltage 1

Reverse Recovery Time

Reverse Recovery Charge 1

Forward Turn–On Time

V

V/°C

Ω

V

S (É)

µA

nA

pF

nC

ns

A

V

ns

µC

nH

°C/W

BVDSS

∆BV

DSS

∆T

J

RDS(on)

VGS(th)

gfs

IDSS

IGSS

IGSS

Ciss

Coss

Crss

Qg

Qgs

Qgd

td(on)

tr

td(off)

tf

IS

ISM

VSD

trr

Qrr

ton

LD

LS

RθJC

RθCS

RθJA

STATIC ELECTRICAL RATINGS

Notes

1) Pulse Test: Pulse Width

≤ 300ms, δ≤ 2%

2) Repetitive Rating – Pulse width limited by maximum junction temperature.

DYNAMIC CHARACTERISTICS

SOURCE – DRAIN DIODE CHARACTERISTICS

Internal Drain Inductance (measured from 6mm down drain lead to centre of die)

Internal Source Inductance (from 6mm down source lead to source bond pad)

Thermal Resistance Junction – Case

Thermal Resistance Case – Sink

Thermal Resistance Junction – Ambient

PACKAGE CHARACTERISTICS

THERMAL CHARACTERISTICS