PACKAGE OPTION ADDENDUM

www.ti.com

1-May-2025

PACKAGING INFORMATION

Orderable

part number

Status

(1)

Material type

(2)

Package | Pins

Package qty | Carrier

RoHS

(3)

Lead finish/

Ball material

(4)

MSL rating/

Peak reflow

(5)

Op temp (°C)

Part marking

(6)

CD4015BE

Active

Production

PDIP (N) | 16

25 | TUBE

Yes

NIPDAU

N/A for Pkg Type

-55 to 125

CD4015BE

CD4015BF

Active

Production

CDIP (J) | 16

25 | TUBE

No

SNPB

N/A for Pkg Type

-55 to 125

CD4015BF

CD4015BF3A

Active

Production

CDIP (J) | 16

25 | TUBE

No

SNPB

N/A for Pkg Type

-55 to 125

CD4015BF3A

CD4015BM

Obsolete

Production

SOIC (D) | 16

-

-

Call TI

Call TI

-55 to 125

CD4015BM

CD4015BM96

Active

Production

SOIC (D) | 16

2500 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-55 to 125

CD4015BM

CD4015BMT

Obsolete

Production

SOIC (D) | 16

-

-

Call TI

Call TI

-55 to 125

CD4015BM

CD4015BPW

Obsolete

Production

TSSOP (PW) | 16

-

-

Call TI

Call TI

-55 to 125

CM015B

CD4015BPWR

Active

Production

TSSOP (PW) | 16

2000 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-55 to 125

CM015B

(1) Status: For more details on status, see our product life cycle.

(2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without

limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available

for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind.

(3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition.

(4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the

finish value exceeds the maximum column width.

(5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per

JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board.

(6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part.

Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the

previous line and the two combined represent the entire part marking for that device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

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