Copper Area 35-µm Thickness

Printed Circuit Board

5V

TTL Logic

1 Ampere

TTL Logic

1 Ampere

GND

VIAS

TTL Logic

5V to 36V

1 Ampere

TTL Logic

1 Ampere

TTL Logic

TTL Logic

14

13

15

1

2

3

4

16

GND

0.1 F

1,2EN

1A

1Y

VCC1

4A

4Y

10

9

11

12

7

8

6

5

2Y

2A

VCC2

3Y

3A

3,4EN

GND

1 F

L293, L293D

SLRS008D – SEPTEMBER 1986 – REVISED JANUARY 2016

www.ti.com

11 Layout

11.1 Layout Guidelines

Place the device near the load to keep output traces short to reduce EMI. Use solid vias to transfer heat from

ground pins to ground plane of the printed-circuit-board.

11.2 Layout Example

Figure 13. Layout Diagram

Figure 14. Example of Printed-Circuit-Board Copper Area (Used as Heat Sink)

14

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Product Folder Links: L293 L293D