©2006 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FOD814 Series, FOD817 Series Rev. 2.9

3

Absolute Maximum Ratings

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be

operable above the recommended operating conditions and stressing the parts to these levels is not recommended.

In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.

The absolute maximum ratings are stress ratings only. TA = 25°C Unless otherwise specified.

Symbol

Parameter

Value

Unit

FOD814

FOD817

Total Device

TSTG

Storage Temperature

-55 to +150

°C

TOPR

Operating Temperature

-55 to +105

-55 to +110

°C

TJ

Junction Temperature

-55 to +125

°C

TSOL

Lead Solder Temperature

260 for 10 seconds

°C



JC

Junction-to-Case Thermal Resistance

210

°C/W

PTOT

Total Device Power Dissipation

200

mW

EMITTER

IF

Continuous Forward Current

±50

50

mA

VR

Reverse Voltage

6

V

PD

Power Dissipation

70

mW

Derate Above 100°C

1.7

mW/°C

DETECTOR

VCEO

Collector-Emitter Voltage

70

V

VECO

Emitter-Collector Voltage

6

V

IC

Continuous Collector Current

50

mA

PC

Collector Power Dissipation

150

mW

Derate Above 90°C

2.9

mW/°C