4

LM2665

SNVS009H – NOVEMBER 1999 – REVISED MARCH 2016

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Copyright © 1999–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3)

OUT may be shorted to GND for one second without damage. However, shorting OUT to V+ may damage the device and must be

avoided. Also, for temperatures above 85°C, OUT must not be shorted to GND or V+, or device may be damaged.

(4)

The maximum allowable power dissipation is calculated by using PD-MAX = (TJ-MAX − TA)/RθJA, where TJ-MAX is the maximum junction

temperature, TA is the ambient temperature, and RθJA is the junction-to-ambient thermal resistance of the specified package.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

V+ to GND voltage

5.8

V

OUT to GND voltage

11.6

V

OUT to V+ voltage

5.8

V

SD

(GND

− 0.3 V)

(V+ + 0.3 V)

V+ and OUT continuous output current

50

mA

Output short-circuit duration to GND(3)

1

sec

Continuous power dissipation (TA = 25°C)

(4)

600

mW

TJ-MAX

(4)

150

°C

Lead temperature (soldering, 10 sec.)

300

°C

Storage temperature, Tstg

−65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Operating junction temperature

–40

85

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.4 Thermal Information

THERMAL METRIC(1)

LM2665

UNIT

DBV (SOT-23)

6 PINS

RθJA

Junction-to-ambient thermal resistance

210

°C/W