LMH6628

SNOSA02D – MAY 2002 – REVISED MARCH 2013

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Figure 2. Inverting Frequency Response

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2)

Human Body Model

2kV

ESD Tolerance(3)

Machine Model

200V

Supply Voltage

13.5

Short Circuit Current

See(4)

Common-Mode Input Voltage

V+ - V−

Differential Input Voltage

V+ - V−

Maximum Junction Temperature

+150°C

Storage Temperature Range

−65°C to +150°C

Lead Temperature (soldering 10 sec)

+300°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications, see the Electrical

Characteristics tables.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3)

Human body model, 1.5k

Ω in series with 100pF. Machine model, 0Ω In series with 200pF.

(4)

Output is short circuit protected to ground, however maximum reliability is obtained if output current does not exceed 160mA.

Operating Ratings

(1)

Thermal Resistance(2)

Package

(

θJC)

(

θJA)

SOIC

65°C/W

145°C/W

Temperature Range

−40°C to +85°C

Nominal Supply Voltage

±2.5V to ±6V

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications, see the Electrical

Characteristics tables.

(2)

The maximum power dissipation is a function of TJ(MAX), θJA and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(MAX)-TA)/ θJA. All numbers apply for packages soldered directly onto a PC board.

2

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