LP38512

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SNOSAU7F – NOVEMBER 2007 – REVISED APRIL 2013

Figure 25.

θJA vs Copper (1 Ounce) Area for DDPAK/TO-263 package

As shown in the figure, increasing the copper area beyond 1 square inch produces very little improvement. The

minimum value for

θJA for the DDPAK/TO-263 package mounted to a two-layer PCB is 32°C/W.

Figure 26 shows the maximum allowable power dissipation for DDPAK/TO-263 packages for different ambient

temperatures, assuming

θJA is 35°C/W and the maximum junction temperature is 125°C.

Figure 26. Maximum Power Dissipation vs Ambient Temperature for DDPAK/TO-263 Package

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