ABSOLUTE MAXIMUM RATINGS

(1)

1

2

3

4

8

7

6

5

I

Q Adjust

E

B

V

− = −5V

C

V+ = +5V

Out

In

+1

Top View

SO

OPA860

SBOS331C – JUNE 2005 – REVISED AUGUST 2008 ....................................................................................................................................................... www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ORDERING INFORMATION(1)

SPECIFIED

PACKAGE

TEMPERATURE

PACKAGE

ORDERING

TRANSPORT MEDIA,

PRODUCT

PACKAGE

DESIGNATOR

RANGE

MARKING

NUMBER

QUANTITY

OPA860ID

Rails, 75

OPA860

SO-8

D

–45°C to +85°C

OPA860

OPA860IDR

Tape and Reel, 2500

(1)

For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

Power Supply

±6.5VDC

Internal Power Dissipation

See Thermal Information

Differential Input Voltage

±1.2V

Input Common-Mode Voltage Range

±VS

Storage Temperature Range: D

–65°C to +125°C

Lead Temperature (soldering, 10s)

+300°C

Junction Temperature (TJ)

+150°C

ESD Rating:

Human Body Model (HBM)(2)

1500V

Charge Device Model (CDM)

1000V

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress Ratings only, and functional operations of the device at these and any other conditions

beyond those specified is not supported.

(2)

Pin 2 > 500V HBM.

PIN CONFIGURATION

2

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