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SN54HC08VTDF1 Datasheet(PDF) 3 Page - Texas Instruments |
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SN54HC08VTDF1 Datasheet(HTML) 3 Page - Texas Instruments |
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3 / 6 page ![]() SN54HC08-DIE www.ti.com SCLS734 – JUNE 2013 Table 1. Bond Pad Coordinates in Microns DESCRIPTION PAD NUMBER X MIN Y MIN X MAX Y MAX 1A 1 166.5 413.1 267.3 513.9 1B 2 166.5 155.7 267.3 256.5 1Y 3 504.9 155.7 605.7 256.5 2A 4 645.3 155.7 746.1 256.5 2B 5 902.7 155.7 1003.5 256.5 2Y 6 1097.1 299.7 1197.9 400.5 GND 7 1097.1 440.1 1197.9 540.9 3Y 8 1097.1 580.5 1197.9 681.3 3A 9 1090.8 888.3 1191.6 989.1 3B 10 834.3 888.3 935.1 989.1 4Y 11 693.9 888.3 794.7 989.1 4A 12 375.3 888.3 476.1 989.1 4B 13 166.5 888.3 267.3 989.1 VCC 14 166.5 632.7 267.3 733.5 Copyright © 2013, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: SN54HC08-DIE |
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