2

UVtransfer R

Specifications

UVtransfer R

LIFT and Repair System

Fully automated system for 24/7 usage in an industrial scale

Dimensions (W x L x H)

Approx. 3000 x 8000 x 3300 mm³

Laser and Optics

Laser

Coherent deep UV laser with 248 nm wavelength

IndyStar 1 kHz

Optical System

Mask Imaging system for high homogeneity, stability and flexibility

Field Size

Repair System: 25 x 10 mm² with scanner

Energy Density

Up to 1200 mJ/cm² for direct transfer from Epi Wafer

Substrates

Donor

Material

Quartz or sapphire wafer of temp. carrier

Dimensions

4” to 8” round of square (customization possible)

microLEDs

Size down to 5 x 5 µm², street width down to 5 µm (CoW and CoC)

Receiver

Material

Technical glass, backplane, temp. carrier

Dimensions

Max. 400 x 600 mm² (GEN 2.5 substrates)

Stage Systems

Donor Stage

Options

- Triple donor stage for RGB generation in one step

- Single donor stage with bow compensation

Receiver Stage

Double receiver stage for parallel processing and loading/unloading/alignment

Diagnostic Systems

Donor Diagnostics

Fiducial and alignment camera

Receiver Diagnostics

Fiducial and alignment camera

Optional: Full sample scanning camera for anomaly detection

Beam Diagnostics

Power meter and beam profiler

Additional Diagnostics

On axis gap measurement system

Through the lens camera

Housing

Laser Protection Class

CLASS IV LASER RADIATION PRODUCT PER EN/IEC 60825-1: 2014

Temperature Control

Temperature stabilization ±0.3 K

Control of Particle Contamination ISO class 5 in process chamber

Optional: Advanced air cleaning system for “ISO 1 mini environment” in the process area

SW and Automatization

SW Features

Path planning and process simulation

Digital twin

Fab integration according to customers infrastructure

Automatization

Fully automated process flow

EFEM integration according to customer needs