PACKAGE OPTION ADDENDUM

www.ti.com

29-May-2025

PACKAGING INFORMATION

Orderable part number

Status

(1)

Material type

(2)

Package | Pins

Package qty | Carrier

RoHS

(3)

Lead finish/

Ball material

(4)

MSL rating/

Peak reflow

(5)

Op temp (°C)

Part marking

(6)

5962-9231901MCA

Active

Production

CDIP (J) | 14

25 | TUBE

No

SNPB

N/A for Pkg Type

-55 to 125

5962-9231901MC

A

SNJ54LS136J

SN54LS136J

Active

Production

CDIP (J) | 14

25 | TUBE

No

SNPB

N/A for Pkg Type

-55 to 125

SN54LS136J

SN54LS136J.A

Active

Production

CDIP (J) | 14

25 | TUBE

No

SNPB

N/A for Pkg Type

-55 to 125

SN54LS136J

SN74LS136DR

Active

Production

SOIC (D) | 14

2500 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

0 to 70

LS136

SN74LS136DR.A

Active

Production

SOIC (D) | 14

2500 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

0 to 70

LS136

SN74LS136N

Active

Production

PDIP (N) | 14

25 | TUBE

Yes

NIPDAU

N/A for Pkg Type

0 to 70

SN74LS136N

SN74LS136N.A

Active

Production

PDIP (N) | 14

25 | TUBE

Yes

NIPDAU

N/A for Pkg Type

0 to 70

SN74LS136N

SN74LS136NE4

Active

Production

PDIP (N) | 14

25 | TUBE

Yes

NIPDAU

N/A for Pkg Type

0 to 70

SN74LS136N

SN74LS136NSR

Active

Production

SOP (NS) | 14

2000 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

0 to 70

74LS136

SN74LS136NSR.A

Active

Production

SOP (NS) | 14

2000 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

0 to 70

74LS136

SNJ54LS136J

Active

Production

CDIP (J) | 14

25 | TUBE

No

SNPB

N/A for Pkg Type

-55 to 125

5962-9231901MC

A

SNJ54LS136J

SNJ54LS136J.A

Active

Production

CDIP (J) | 14

25 | TUBE

No

SNPB

N/A for Pkg Type

-55 to 125

5962-9231901MC

A

SNJ54LS136J

(1) Status: For more details on status, see our product life cycle.

(2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance,

reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional

waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind.

(3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition.

(4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum

column width.

(5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown.

Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board.

Addendum-Page 1