SCD55100A, SCD55101A, SCD55102A, SCD55103A, SCD55104A

2006-02-20

10

Row Strobing

Multiplexer and Display Driver

The ten characters are row multiplexed with RAM resident column

data. The strobe rate is established by the internal or external

MUX Clock rate. The MUX Clock frequency is divided by a 320

counter chain. This results in a typical strobe rate of 750 Hz. By

pulling the Clock SEL line low, the display can be operated from an

external MUX Clock. The external clock is attached to the CLK I/O

connection (pin 15). The maximum external MUX Clock frequency

should be limited to 1.0 MHz.

An asynchronous hardware Reset (pin 13) is also provided. Bring-

ing this pin low will clear the Character Address Register, Control

Word Register, RAM, and blanks the display. This action leaves the

display set at Character Address 0, and the Brightness Level set at

100%.

Electrical & Mechanical Considerations

Interconnect Considerations

Optimum product performance can be had when the following

electrical and mechanical recommendations are adopted. The

SCD5510XA’s IC is constructed in a high speed CMOS process,

consequently high speed noise on the SERIAL DATA, SERIAL

DATA CLOCK, LOAD and RESET lines may cause incorrect data

to be written into the serial shift register. Adhere to transmission

line termination procedures when using fast line drivers and long

cables (>10 cm).

Good digital grounds (pins 14, 28) and power supply decoupling

(pins 6, 9, 20, 23) will insure that I

currents do not generate localized ground bounce. Therefore it is

recommended that each display package use a 0.1 µF and 20 µF

capacitor between V

When the internal MUX Clock is being used connect the CLKSEL

pin to V

nected to the system’s reset control, it is recommended that this

pin be connected to the center node of a series 0.1 µF and 100 k

Ω

RC network. Thus upon initial power up the RESET will be held

low for 10 ms allowing adequate time for the system power supply

to stabilize.

The SCD5510XA allows up to 1.7 W of power dissipation at 70°

and 1.29 W power dissipation at a maximum operating tempera-

ture of 85°C. Approximately 60% of this power is dissipated by the

IC to the PC board via the V

mum thermal reliability is obtained by connecting all of the V

CC

pins to a common pad located on both sides of the PC board. This

technique offers a low thermal resistance for IC to system ambi-

ent.

ESD Protection

The input protection structure of the SCD55100A/1A/2A/3A/4A

provides significant protection against ESD damage. It is capable

of withstanding discharges greater than 2.0 kV. Take all the stan-

dard precautions, normal for CMOS components. These include

properly grounding personnel, tools, tables, and transport carriers

that come in contact with unshielded parts. If these conditions are

not, or cannot be met, keep the leads of the device shorted

together or the parts in anti-static packaging.

Soldering Considerations

The SCD55100A/1A/2A/3A/4A can be hand soldered with SN63

solder using a grounded iron set to 260°C.

Wave soldering is also possible following these conditions: Pre-

heat that does not exceed 93°C on the solder side of the PC board

or a package surface temperature of 85°C. Water soluble organic

acid flux (except carboxylic acid) or rosin-based RMA flux without

alcohol can be used.

Wave temperature of 245°C ± 5°C with a dwell between 1.5 sec. to

3.0 sec. Exposure to the wave should not exceed temperatures

above 260°C for five seconds at 1.59 mm (0.063") below the seat-

ing plane. The packages should not be immersed in the wave.

Post Solder Cleaning Procedures

The least offensive cleaning solution is hot D.I. water (60°C) for

less than 15 minutes. Addition of mild saponifiers is acceptable. Do

not use commercial dishwasher detergents.

For faster cleaning, solvents may be used. Exercise care in choos-

ing solvents as some may chemically attack the nylon package.

Maximum exposure should not exceed two minutes at elevated tem-

peratures. Acceptable solvents are TF (trichlorotrifluorethane), TA,

111 Trichloroethane, and unheated acetone.

(1)

Note:

1)

Acceptable commercial solvents are: Basic TF, Arklone, P.

Genesolv,

D. Genesolv DA, Blaco-Tron TF and Blaco-Tron TA.

Unacceptable solvents contain alcohol, methanol, methylene

chloride, ethanol, TP35, TCM, TMC, TMS+, TE, or TES. Since

many commercial mixtures exist, contact a solvent vendor for

chemical composition information. Some major solvent manufac-

turers are: Allied Chemical Corporation, Specialty Chemical Divi-

sion, Morristown, NJ; Baron-Blakeslee, Chicago, IL; Dow

Chemical, Midland, MI; E.I. DuPont de Nemours & Co., Wilming-

ton, DE.

IDXX5188

Row 0

Row 1

Row 2

Row 3

Row 4

01 2 3 4

Columns

Load Row 0

Load

4

Row 4

Columns

1

0

2 3

Row 3

Row 1

Row 0

Row 2

Load Row 1

Columns

Row 4

1

0

2

4

3

Load Row 2

Row 2

Row 1

Row 3

Row 0

Row 4

0

Columns

2

13 4

Load Row 3

Row 0

Row 3

Row 1

Row 2

Row 4

Columns

01 2

4

3

Row 2

Row 1

Row 3

Row 0

Load Row 4

Row