PC93

Non-Silicone Thermal Conductive Pad

Thermal Conductivity: 2 W/m.k

(W / m.k - Z Axis)

In the thermal resistance vs pressure vs deflection charts PC93 provides low thermal impedance.

As the pressure increases the thermal impedance decreases. PC93 provides good compliance and softness.

Hardeness: 60 (Shore 00)

(Shore 00)

Low contact thermal impedance

Good thermal conductivity

Silicone free

Long term stability

Electronic components: IC / CPU / MOS

LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /

Wireless Hub etc....

DDR II Module / DVD Applications / Hand-Set applications etc...

Features

Applications

Thermal Resistance V.S Pressure V.S Deflection

Properties

REACH Compliant

RoHS Compliant

Property

PC93

Unit

Tolerance

Test Method

Colour

Grey

-

-

Visual

Thickness

(Available thickness range)

0.25 ~ 5.0

mm

-

ASTM D374

0.0098~0.1969

inch

-

ASTM D374

Thermal Conductivity

2

W/m.k

-

ASTM D5470

Flame Rating

V-0

-

-

UL 94

Dielectric Breakdown Voltage

10

kV/mm

-

ASTM D149

Weight Loss

‹1

%

-

ASTM E595

Specific Gravity

1.5

g/cm3

±0.2

ASTM D792

Working Temperature

-30~ 150

˚C

-

-

Volume Resistance

›1012

Ohm-cm

-

ASTM D257

Elongation

350

%

±13

ASTM D412

Tensile Strength

1

Kgf/mm2

±2

ASTM D412

Standard Shape

-

Sheet ones

-

-

Hardness

60

Shore 00

±5

ASTM D2240

Available with an adhesive backing

1. Part Number

2. Size X-Y-Z

3. Adhesive backing – 0-None, 1A-one side, 2A-two sides

4. Quantity

Tel: +44 20 8133 2062 Email: sales@tglobaltechnology.com Web: www.tglobaltechnology.com Skype: tglobal.technology