Electronic Components Datasheet Search
  English  ▼

X  

TL4242 Datasheet(PDF) 12 Page - Texas Instruments

Part # TL4242
Description  TL4242 500-mA, Adjustable, Constant-Current LED Driver
PDF  21 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

TL4242 Datasheet(HTML) 12 Page - Texas Instruments

Back Button TL4242 Datasheet HTML 8Page - Texas Instruments TL4242 Datasheet HTML 9Page - Texas Instruments TL4242 Datasheet HTML 10Page - Texas Instruments TL4242 Datasheet HTML 11Page - Texas Instruments TL4242 Datasheet HTML 12Page - Texas Instruments TL4242 Datasheet HTML 13Page - Texas Instruments TL4242 Datasheet HTML 14Page - Texas Instruments TL4242 Datasheet HTML 15Page - Texas Instruments TL4242 Datasheet HTML 16Page - Texas Instruments Next Button
Zoom Inzoom in Zoom Outzoom out
 12 / 21 page
background image
PWM
Via to GND Plane
ST
GND
REF
D
NC
I
To µC
To pullup
source
Q
To power supply
To µC
RREF
TL4242
SLVS641B – APRIL 2008 – REVISED MARCH 2015
www.ti.com
9 Power Supply Recommendations
The input voltage at the I pin must be greater than the sum of the LED forward voltages, the voltage drop across
the TL4242 (from I to Q), and the voltage drop across the shunt resistor RREF. For an example of this calculation,
refer to Typical Application. The input voltage should not exceed the recommended maximum operation voltage
of 42 V.
10 Layout
10.1 Layout Guidelines
The REF pin should be routed directly to the shunt resistor, RREF. If there is a long PCB trace between the LED
string and the shunt resistor, the REF pin should connect close to the shunt resistor (rather than close to the LED
string) to allow for accurate sensing across the shunt resistor.
The traces for I and Q will carry the full LED current. These traces should be the appropriate width to carry the
LED current.
The exposed thermal pad on the bottom of the TL4242 should be connected to the PCB. The thermal pad helps
to dissipate heat in the case of high power dissipation in the device. To further enhance the thermal performance
of the device, the thermal pad can be connected by vias to the ground layer in the PCB.
10.2 Layout Example
Figure 8. PCB Layout
12
Submit Documentation Feedback
Copyright © 2008–2015, Texas Instruments Incorporated
Product Folder Links: TL4242



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21


Datasheet Download

Go To PDF Page


Link URL



Does ALLDATASHEET help your business so far?  [ DONATE ] 

About Alldatasheet   |   Advertisement   |   Contact us   |   Privacy Policy   |   Link to Datasheet    |   Link Exchange   |   Manufacturer List
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com