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TLE202XY CHIP INFORMATION

BONDINGPAD ASSIGNMENTS

ChipThickness:15MiIsTypical

BondingPads:4

4MilsMinimum

´

T max=150 C

J

°

Tolerances Are 10%.

±

AllDimensions AreinMils.

Pin(4)isInternallyConnected

toBacksideofChip.

(1)

(2)

(3)

(4)

(5)

(6)

(7)

(8)

90

73

(1)

(2)

(3)

(4)

(6)

(7)

(8)

+

-

OUT

IN+

IN-

V

CC+

V

CC-

OFFSETN1

OFFSETN2

(1)

(3)

(2)

(8)

(7)

(4)

(6)

TLE2027-EP

Excalibur™ LOW-NOISE HIGH-SPEED

PRECISION OPERATIONAL AMPLIFIER

SLOS511 – JUNE 2007

This chip, when properly assembled, displays characteristics similar to the TLE202xC. Thermal compression or

ultrasonic bonding may be used on the doped-aluminum bonding pads. The chip may be mounted with

conductive epoxy or a gold-silicon preform.

3

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