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TLV703 Datasheet(PDF) 13 Page - Texas Instruments

Part # TLV703
Description  TLV703 300-mA, Low-IQ, Low-Dropout Regulator
PDF  24 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

TLV703 Datasheet(HTML) 13 Page - Texas Instruments

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P =(V
V
)
I
-
´
D
IN
OUT
OUT
1 ms/div
V
OUT
V
IN
2.9 V
2.3 V
10 ms/div
V
OUT
I
OUT
50 mA
0 mA
13
TLV703
www.ti.com
SBVS305 – MARCH 2017
Product Folder Links: TLV703
Submit Documentation Feedback
Copyright © 2017, Texas Instruments Incorporated
Although an input capacitor is not required for stability, good analog design practice is to connect a 0.1-µF to
1-µF, low ESR capacitor across the IN pin and GND pin of the regulator. This capacitor counteracts reactive
input sources and improves transient response, noise rejection, and ripple rejection. A higher-value capacitor
may be necessary if large, fast rise-time load transients are anticipated, or if the device is not located close to the
power source. If source impedance is more than 2 Ω, a 0.1-μF input capacitor may be necessary to ensure
stability.
8.2.2.2 Transient Response
As with any regulator, increasing the size of the output capacitor reduces overshoot and undershoot magnitude
but increases the duration of the transient response.
8.2.3 Application Curves
VOUT = 1.8 V, tR = tF = 1 µs
Figure 23. Load Transient Response
VOUT = 1.8 V, IOUT = 1 mA, slew rate = 1 V/µs
Figure 24. Line Transient Response
9 Power Supply Recommendations
Connect a low output impedance power supply directly to the IN pin of the TLV703. Inductive impedances
between the input supply and the IN pin can create significant voltage excursions at the IN pin during start-up or
load transient events.
9.1 Power Dissipation
The ability to remove heat from the die is different for each package type, presenting different considerations in
the printed-circuit-board (PCB) layout. The PCB area around the device that is free of other components moves
the heat from the device to the ambient air; see the Thermal Information section for thermal performance on the
TLV703 evaluation module (EVM). The EVM is a two-layer board with two ounces of copper per side.
Power dissipation depends on input voltage and load conditions. Equation 1 shows that power dissipation (PD) is
equal to the product of the output current and the voltage drop across the output pass element.
(1)



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