TMP814

SLDS151A – MAY 2009 – REVISED JUNE 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VCC

Supply voltage

18

V

VOUT

Output voltage

OUT1P, OUT1N, OUT2P, OUT2N

18

V

IOUT

Continuous output current

OUT1P, OUT1N, OUT2P, OUT2N

50

mA

IHB

Continuous output current

HB

10

mA

VTH

Input voltage

VTH

8

V

VRD

Output voltage

RD, FG

18

V

VFG

IRD

Continuous output current

RD, FG

10

mA

IFG

Tstg

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

±2500

V(ESD)

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification JESD22-C101, all

±1000

pins(2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

TA = 25°C

MIN

MAX

UNIT

VCC

Supply voltage

6

16

V

VTH

VTH input voltage

Full-speed mode

0

7

V

VICM

Hall input common phase input voltage

0.2

3

V

TA

Operating free-air temperature

–30

95

°C

6.4 Thermal Information

TMP814

THERMAL METRIC(1)

PW (TSSOP)

UNIT

20 PINS

RθJA

Junction-to-ambient thermal resistance

83

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

90.6

°C/W

RθJB

Junction-to-board thermal resistance

42.1

°C/W

ψJT

Junction-to-top characterization parameter

24.3

°C/W

ψJB

Junction-to-board characterization parameter

0.9

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

41.5

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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