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LAW5SN Datasheet(PDF) 12 Page - OSRAM GmbH |
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LAW5SN Datasheet(HTML) 12 Page - OSRAM GmbH |
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12 / 17 page  2007-08-16 12 Vorläufige Daten / Preliminary Data LR W5SN, LA W5SN, LY W5SN Empfohlenes Lötpaddesign 8) Seite 17 IR-Reflow Löten Recommended Solder Pad 8) page 17 IR Reflow Soldering Thermal enhanced PCB Thermisch optimiertes PCB 3 Lötstellen 3 solder points 1.6 (0.063) 11.6 (0.457) ø4.0 (0.157) Heatsink attach 11.6 (0.457) 12.0 (0.472) ø4.0 (0.157) ø2.5 (0.098) Kupfer Copper 1.6 (0.063) OHPY2844 Solder paste stencil Lötpasten Schablone Lötstopplack Solder resist Bare Copper Freies Kupfer Footprint Empfohlene Padgeometrie Recommended Solder Pad Design Achtung: Anode und Heatsink sind elektrisch verbunden Attention: Anode and Heatsink are electrically connected |
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