TLC070CDRG4 datasheet(22/50 Pages) TI

22 / 50 page

TLC070, TLC071, TLC072, TLC073, TLC074, TLC075, TLC07xA

FAMILY OF WIDEBANDWIDTH HIGHOUTPUT DRIVE SINGLE SUPPLY

OPERATIONAL AMPLIFIERS

SLOS219E − JUNE 1999 − REVISED SEPTEMBER 2006

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• HOUSTON, TEXAS 77251−1443

APPLICATION INFORMATION

general PowerPAD design considerations

The TLC07x is available in a thermally-enhanced PowerPAD family of packages. These packages are

constructed using a downset leadframe upon which the die is mounted [see Figure 52(a) and Figure 52(b)]. This

arrangement results in the lead frame being exposed as a thermal pad on the underside of the package [see

Figure 52(c)]. Because this thermal pad has direct thermal contact with the die, excellent thermal performance

can be achieved by providing a good thermal path away from the thermal pad.

The PowerPAD package allows for both assembly and thermal management in one manufacturing operation.

During the surface-mount solder operation (when the leads are being soldered), the thermal pad must be

soldered to a copper area underneath the package. Through the use of thermal paths within this copper area,

heat can be conducted away from the package into either a ground plane or other heat dissipating device.

Soldering the PowerPAD to the PCB is always required, even with applications that have low-power dissipation.

This provides the necessary thermal and mechanical connection between the lead frame die pad and the PCB.

The PowerPAD package represents a breakthrough in combining the small area and ease of assembly of

surface mount with mechanical methods of heatsinking.

DIE

Side View (a)

End View (b)

Bottom View (c)

DIE

Thermal

Pad

NOTE A: The thermal pad is electrically isolated from all terminals in the package.

Figure 52. Views of Thermally-Enhanced DGN Package

TLC070CDRG4 Datasheet(PDF) 22 Page - Texas Instruments