ZL40268 datasheet(49/56 Pages) MICROCHIP

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 2020-2021 Microchip Technology Inc.

DS20006412C-page 49

ZL40268

FIGURE 5-2:

48-LEAD QFN 7 MM X 7 MM PACKAGE OUTLINE AND RECOMMENDED LAND

PATTERN

Microchip Technology Drawing C04-242 Rev B Sheet 2 of 2

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Number of Pins

Overall Height

Terminal Width

Overall Width

Overall Length

Terminal Length

Exposed Pad Width

Exposed Pad Length

Terminal Thickness

Pitch

Standoff

Units

Dimension Limits

(A3)

0.50 BSC

0.20 REF

5.00

0.30

0.20

0.80

0.00

0.25

0.40

5.10

0.85

0.01

7.00 BSC

MILLIMETERS

MIN

NOM

5.20

0.50

0.30

0.90

0.05

MAX

0°

12°

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Pin 1 visual index feature may vary, but must be located within the hatched area.

Package is punch singulated

Dimensioning and tolerancing per ASME Y14.5M

Mold Draft Angle

0.60

0.65

0.70

6.75 BSC

Mold Cap Height

Molded Top Width

Molded Top Length

Terminal-to-Exposed-Pad

0.20

7.00 BSC

6.75 BSC

DETAIL A

DETAIL B

Terminal Dimple Width

0.10

0.15

0.20

Terminal Dimple Length (side)

Terminal Dimple Length (bottom)

0.05

0.15

0.25

0.05

0.10

0.15

Corner Chamfer

0.24

0.42

0.60

TERMINAL DIMPLES

48-Lead Plastic Quad Flat, No Lead Package (5E) - 7x7 mm Body [QFN], 0.40 mm Terminals

With 5.1x5.1 mm Exposed Pad; Punch Singulated, Dimpled Terminals

5.00

5.10

5.20

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