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TX7516 Datasheet(PDF) 4 Page - Texas Instruments |
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TX7516 Datasheet(HTML) 4 Page - Texas Instruments |
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4 / 9 page ![]() 6 Device and Documentation Support 6.1 Document Support Table 6-1. Terms Commonly Used in the Data Sheet Abbreviation Comment PRT Pulse Repetition Time. Represent TR_BF_SYNC period PRF Pulse Repetition Frequency. Represent TR_BF_SYNC frequency Receive Mode Duration in which T/R switch of all the channels are in ON state High voltage supplies AVDDP_HV_A, AVDDP_HV_B, AVDDM_HV_A, and AVDDM_HV_B are collectively referred as high voltage supplies High voltage supplies AVDDP_5, AVDDM_5, and AVDDP_1P8 supplies are collectively referred as low voltage supplies A-side supplies AVDDP_HV_A and AVDDM_HV_A is referred as A-side supplies B-side supplies AVDDP_HV_A and AVDDM_HV_A is referred as B-side supplies SPI Serial program interface 6.2 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 6.3 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 6.4 Trademarks TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners. 6.5 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 6.6 Glossary TI Glossary This glossary lists and explains terms, acronyms, and definitions. 7 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this datasheet, refer to the left-hand navigation. TX7516 SLOSE40A – JUNE 2021 – REVISED MARCH 2022 www.ti.com 4 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: TX7516 |
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