5.2 ESD Ratings—JEDEC Specification

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/

JEDEC JS-001 (1)

±2500

V

Charged device model (CDM), per JEDEC

specification JS-002 (2)

±1000

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufactuuring with a standard ESD control proccess

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufactuuring with a standard ESD control proccess.

5.3 ESD Ratings—IEC Specification

VALUE

UNIT

V(ESD)

Electrostatic discharge

IEC 61000-4-2 contact discharge

±30000

V

IEC 61000-4-2 air-gap discharge

±30000

5.4 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

TA

Operating free-air temperature

-55

150

°C

5.5 Thermal Information

THERMAL METRIC (1)

TSD05C

TSD12C / TSD15C /

TSD18C

TSD24C / TSD36C

UNIT

DYF (SOD-323)

DYF (SOD-323)

DYF (SOD-323)

2 PINS

2 PINS

2 PINS

RθJA

Junction-to-ambient thermal resistance

672.0

683.8

686.1

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

230.5

264.2

267.0

°C/W

RθJB

Junction-to-board thermal resistance

541.4

559.0

560.5

°C/W

ΨJT

Junction-to-top characterization parameter

64.4

89.9

91.4

°C/W

ΨJB

Junction-to-board characterization parameter

527.5

544.8

546.2

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

TSD05C, TSD12C, TSD15C, TSD18C, TSD24C, TSD36C

SLVSH42C – JUNE 2023 – REVISED OCTOBER 2024

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