LM1771

SNVS446D – JUNE 2006 – REVISED JANUARY 2016

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6 Specifications

6.1 Absolute Maximum Ratings

See

(1) (2)

MIN

MAX

UNIT

VIN

–0.3

6

V

EN, FB, HG, LG

–0.3

VIN

V

Junction temperature

150

°C

Lead temperature

Soldering, 10 sec

260

°C

Storage temperature, Tstg

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN

MAX

UNIT

VIN to GND

2.8

5.5

V

Junction temperature, TJ

−40

125

°C

6.4 Thermal Information

LM1771

THERMAL METRIC(1)

NGG (WSON)

DGK (VSSOP)

UNIT

6 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

52.8

169.2

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

51.4

59.7

°C/W

RθJB

Junction-to-board thermal resistance

27.2

89.3

°C/W

ψJT

Junction-to-top characterization parameter

0.7

7.0

°C/W

ψJB

Junction-to-board characterization parameter

27.3

87.9

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

7.4

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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