Maximum rating

M41T315Y, M41T315V, M41T315W

18/30

4

Maximum rating

Stressing the device above the rating listed in the “Absolute Maximum Ratings” table may

cause permanent damage to the device. These are stress ratings only and operation of the

device at these or any other conditions above those indicated in the Operating sections of

this specification is not implied. Exposure to Absolute Maximum Rating conditions for

extended periods may affect device reliability. Refer also to the STMicroelectronics SURE

Program and other relevant quality documents.

Caution:

Negative undershoots below –0.3V are not allowed on any pin while in the Battery Back-up

mode.

Caution:

Do NOT wave solder SOIC to avoid damaging SNAPHAT sockets.

Table 6.

Ablolute maximum ratings

Symbol

Parameter

Value

Unit

Operating temperature

–40 to +85

°

C

–40 to +85

°

C

SOIC

–55 to +125

°

C

(1)

Lead solder temperature for 10 seconds

260

°

C

Supply voltage (on any pin relative to Ground)

M41T315Y

–0.3 to +7.0

V

M41T315V/W

–0.3 to +4.6

V

Input or output voltages

V

Output current

20

mA

Power dissipation

1

W

1.

For SO package, Lead-free (Pb-free) lead finish: Reflow at peak temperature of 260°C (total thermal budget not to exceed

245°C for greater than 30 seconds).