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MSP430C1111IPW Datasheet(PDF) 13 Page - Texas Instruments |
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MSP430C1111IPW Datasheet(HTML) 13 Page - Texas Instruments |
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13 / 40 page ![]() MSP430C11x1, MSP430F11x1A MIXED SIGNAL MICROCONTROLLER SLAS241H − SEPTEMBER 1999 − REVISED SEPTEMBER 2004 13 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 absolute maximum ratings† Voltage applied at VCC to VSS −0.3 V to 4.1 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Voltage applied to any pin (see Note) −0.3 V to VCC+0.3 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Diode current at any device terminal ±2 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Storage temperature, Tstg (unprogrammed device) −55 °C to 150°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Storage temperature, Tstg (programmed device) −40 °C to 85°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE: All voltages referenced to VSS. The JTAG fuse-blow voltage, VFB, is allowed to exceed the absolute maximum rating. The voltage is applied to the TEST pin when blowing the JTAG fuse. recommended operating conditions MIN NOM MAX UNITS MSP430C11x1 1.8 3.6 Supply voltage during program execution, VCC (see Note 1) MSP430C11x1 1.8 3.6 V Supply voltage during program execution, VCC (see Note 1) MSP430F11x1A 1.8 3.6 V Supply voltage during program/erase flash memory, VCC MSP430F11x1A 2.7 3.6 V Supply voltage, VSS 0 V Operating free-air temperature range, TA MSP430x11x1(A) −40 85 °C LFXT1 crystal frequency, LF mode selected, XTS=0 Watch crystal 32 768 Hz LFXT1 crystal frequency, f(LFXT1) (see Note 1 & 2) XT1 mode selected, XTS=1 Ceramic resonator 450 8000 kHz f(LFXT1) (see Note 1 & 2) XT1 mode selected, XTS=1 Crystal 1000 8000 kHz Processor frequency f(system) (MCLK signal) VCC = 1.8 V, MSP430x11x1(A) dc 4.15 MHz Processor frequency f(system) (MCLK signal) VCC = 3.6 V, MSP430x11x1(A) dc 8 MHz NOTES: 1. In LF mode, the LFXT1 oscillator requires a watch crystal. A 5.1M Ω resistor from XOUT to VSS is recommended when VCC < 2.5 V. In XT1 mode, the LFXT1 and XT2 oscillators accept a ceramic resonator or crystal up to 4.15MHz at VCC ≥ 2.2 V. In XT1 mode, the LFXT1 and XT2 oscillators accept a ceramic resonator or crystal up to 8MHz at VCC ≥ 2.8 V. 2. In LF mode, the LFXT1 oscillator requires a watch crystal. In XT1 mode, LFXT1 accepts a ceramic resonator or a crystal. 1.8 V 3.6 V 2.7 V 3 V 4.15 MHz 8.0 MHz Supply Voltage − V Supply voltage range, ’F11x1A, during flash memory programming Supply voltage range, ’x11x1(A), during program execution NOTE: Minimum processor frequency is defined by system clock. Flash program or erase operations require a minimum VCC of 2.7 V. fSYSTEM (MHz) Figure 1. Frequency vs Supply Voltage, MSP430x11x1(A) |
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