TLC5916, TLC5917

SLVS695D – JUNE 2007 – REVISED JANUARY 2015

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7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VDD

Supply voltage

0

7

V

VI

Input voltage

–0.4

VDD + 0.4

V

VO

Output voltage

–0.5

20

V

fclk

Clock frequency

25

MHz

IOUT

Output current

120

mA

IGND

GND terminal current

960

mA

TA

Operating free-air temperature

–40

125

°C

TJ

Operating junction temperature

–40

150

°C

Tstg

Storage temperature

–55

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±1500

V(ESD)

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±500

C101(2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

MIN

MAX

UNIT

VDD

Supply voltage

3

5.5

V

VO

Supply voltage to output pins

OUT0–OUT7

20

V

VO ≥ 0.6 V

3

IO

Output current

DC test circuit

mA

VO ≥ 1 V

120

IOH

High-level output current source

SDO shorted to GND

–1

mA

IOL

Low-level output current sink

SDO shorted to VCC

1

mA

VIH

High-level input voltage

CLK, OE(ED2), LE(ED1), and SDI

0.7 × VDD

VDD

V

VIL

Low-level input voltage

CLK, OE(ED2), LE(ED1), and SDI

0

0.3 × VDD

V

7.4 Thermal Information

TLC5916

TLC5917

THERMAL METRIC(1)

16 PINS

16 PINS

UNIT

D

N

PW

D

N

PW

RθJA

Junction-to-ambient thermal resistance

87.4

51.8

113.9

87.4

51.8

114.8

RθJC(top) Junction-to-case (top) thermal resistance

48.1

39.1

35.2

48.1

39.1

35.9

RθJB

Junction-to-board thermal resistance

44.4

31.8

59.2

44.4

31.8

59.8

°C/W

ψJT

Junction-to-top characterization parameter

12.5

23.9

1.3

12.5

23.9

1.3

ψJB

Junction-to-board characterization parameter

44.2

31.7

58.5

44.2

31.7

59.2

RθJC(bot) Junction-to-case (bottom) thermal resistance

—

—

—

—

—

—

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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