Time = 250 µs/div

ICOIL = 2A/div

VOUT = 1V/div

Time = 10 µs/div

ICOIL = 2A/div

VOUT = 0.1V/div, AC

LOAD = 2A/div

1A to 3.5A load step

Time = 250 µs/div

ICOIL = 2A/div

VOUT = 1V/div

16

TLV62095

SLVSDD3A – MARCH 2016 – REVISED JANUARY 2017

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Figure 20. Load Transient, VOUT = 1.8 V

Figure 21. Short Circuit, HICCUP Protection Entry

Figure 22. Short Circuit, HICCUP Protection Exit

9 Power Supply Recommendations

The TLV62095 device has no special requirements for its input power supply. The input power supply's output

current needs to be rated according to the supply voltage, output voltage and output current of the TLV62095.

10 Layout

10.1 Layout Guidelines

•

It is recommended to place the input capacitor as close as possible to the IC pins PVIN and PGND.

•

The VOS connection is noise sensitive and needs to be routed short and direct to the output terminal of the

inductor.

•

The exposed thermal pad of the package, analog ground (pin 6) and power ground (pin 14, 15) should have a

single point connection at the exposed thermal pad of the package. This minimizes switch node jitter.

•

The charge pump capacitor connected to CP and CN should be placed close to the IC to minimize coupling of

switching waveforms into other traces and circuits.

•

Refer to Figure 23 for an example of component placement, routing and thermal design.