TMP300B-Q1

SBOS586

– DECEMBER 2011

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ORDERING INFORMATION(1)

ORDERABLE P/N

TA

PACKAGE

TOP SIDE SYMBOL

TMP300BQDCKRQ1 or

-40

°C to 125°C

SC70 - DCK | Reel of 3000

SBG

TMP300B-Q1

(1)

For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

(1)

VALUE

UNIT

Supply Voltage

V+

+18

V

Signal Input Terminals, Voltage(2)

–0.5 to (V+) + 0.5

V

Signal Input Terminals, Current(2)

±10

mA

Output Short-Circuit(3)

ISC

Continuous

Open-Drain Output

(V+) + 0.5

V

Operating Temperature

TA

–40 to +150

°C

Storage Temperature

TA

–55 to +150

°C

Junction Temperature

TJ

+150

°C

Human Body Model (HBM)

4000

V

ESD Rating

Charged Device Model (CDM)

1000

V

Machine Model (MM)

200

V

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not supported.

(2)

Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should

be current limited to 10mA or less.

(3)

Short-circuit to ground.

2

Submit Documentation Feedback

Copyright

© 2011, Texas Instruments Incorporated

Product Folder Link(s): TMP300B-Q1