TPS65137AS

SLVSB21B – AUGUST 2011 – REVISED SEPTEMBER 2013

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ORDERING INFORMATION(1) (2)

TA

PACKAGE(2)

ORDERABLE PART

TOP-SIDE MARKING

NUMBER

–40°C to 85°C

10-Pin 3x3 QFN

TPS65137ASDSCR

PPGC

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted)

(1)

VALUE

UNIT

MIN

MAX

PVIN, SWP, OUTP, CTRL, VL, CB

5.5

V

OUTN

–6.5

V

Pin Voltage(2)

SWN

–6.5

5.5

V

CT

3.6

V

HBM

2

kV

ESD rating

MM

200

V

CDM

500

V

TJ

Operating junction temperature range

–40

50

°C

TA

Operating ambient temperature range

–40

85

°C

Tstg

Storage temperature range

–65

150

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.

(2)

With respect to GND pin.

THERMAL INFORMATION

TPS65137AS

THERMAL METRIC(1)

DSC

UNITS

10

θJA

Junction-to-ambient thermal resistance

56.5

θJB

Junction-to-board thermal resistance

25.2

°C/W

ψJT

Junction-to-top characterization parameter

1.0

ψJB

Junction-to-board characterization parameter

17.9

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

RECOMMENDED OPERATING CONDITIONS

MIN

TYP

MAX

UNIT

VIN

Input supply voltage range

2.5

3.7

4.8

V

TA

Operating ambient temperature

–40

25

85

°C

TJ

Operating junction temperature

–40

85

125

°C

2

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