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SN74HCS03 Datasheet(PDF) 4 Page - Texas Instruments

Part # SN74HCS03
Description  SN74HCS03-Q1 Automotive Quadruple 2-Input NAND Gates with Open-Drain Outputs and Schmitt-Trigger Inputs
PDF  24 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

SN74HCS03 Datasheet(HTML) 4 Page - Texas Instruments

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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
MAX
UNIT
VCC
Supply voltage
–0.5
7
V
IIK
Input clamp current(2)
VI < –0.5 V or VI > VCC +
0.5 V
±20
mA
IOK
Output clamp current(2)
VI < –0.5 V or VI > VCC +
0.5 V
±20
mA
IO
Continuous output current
VO = 0 to VCC
±35
mA
ICC
Continuous current through VCC or GND
±70
mA
TJ
Junction temperature(3)
150
°C
Tstg
Storage temperature
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
(2)
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
(3)
Guaranteed by design.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human body model (HBM), per AEC Q100-002(1)
HBM ESD Classification Level 2
±4000
V
Charged device model (CDM), per AEC
Q100-011 CDM ESD Classification Level C6
±1500
(1)
AEC Q100-002 indicate that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
VCC
Supply voltage
2
5
6
V
VI
Input voltage
0
VCC
V
VO
Output voltage
0
VCC
V
TA
Ambient temperature
–40
125
°C
6.4 Thermal Information
THERMAL METRIC(1)
SN74HCS03-Q1
UNIT
PW (TSSOP)
D (SOIC)
14 PINS
14 PINS
RθJA
Junction-to-ambient thermal resistance
151.7
133.6
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
79.4
89
°C/W
RθJB
Junction-to-board thermal resistance
94.7
89.5
°C/W
ΨJT
Junction-to-top characterization parameter
25.2
45.5
°C/W
ΨJB
Junction-to-board characterization parameter
94.1
89.1
°C/W
SN74HCS03-Q1
SCLS759A – APRIL 2020 – REVISED OCTOBER 2020
www.ti.com
4
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Copyright © 2020 Texas Instruments Incorporated
Product Folder Links: SN74HCS03-Q1



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