THS6092, THS6093

275 mA, +12 V ADSL CPE LINE DRIVERS

SLOS345C − JANUARY 2001 − REVISED OCTOBER 2002

2

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

AVAILABLE OPTIONS

PACKAGED DEVICE

TA

SOIC-8†

(D)

SOIC-8†

PowerPAD

(DDA)

SOIC-14†

(D)

TSSOP-14†

PowerPAD

(PWP)

EVALUATION

MODULES

0

°C to 70°C

THS6092CD

THS6092CDDA

THS6093CD

THS6093CPWP

THS6092EVM

THS6093EVM

−40

°C to 85°C

THS6092ID

THS6092IDDA

THS6093ID

THS6093IPWP

—

† All packages are available taped and reeled. Add an R-suffix to the device type (i.e., THS6092IDR).

absolute maximum ratings over operating free-air temperature (unless otherwise noted)†

Supply voltage, VCC+ to VCC−

14.7 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input voltage

± VCC

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Output current (see Note 1)

350 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Differential input voltage

± 3 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Maximum junction temperature

150

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Total power dissipation at (or below) 25

°C free-air temperature

See Dissipation Ratings Table

. . . . . . . . . . .

Operating free-air temperature, TA: Commercial

0

°C to 70°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Industrial

−40

°C to 85°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Storage temperature, Tstg : Commercial

−65

°C to 125°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Industrial

−65

°C to 125°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

300

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTE 1: The THS6092 and THS6093 may incorporate a PowerPAD

 on the underside of the chip. This acts as a heatsink and must be

connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction

temperature which could permanently damage the device. See TI Technical Brief SLMA002 for more information about utilizing the

PowerPAD

 thermally enhanced package.

DISSIPATION RATING TABLE

PACKAGE

θJA

θJC

TA = 25°C§

POWER RATING

TA = 70°C§

POWER RATING

TA = 85°C§

POWER RATING

D-8

95

°C/W‡

38.3

°C/W‡

1.1 W

0.63 W

0.47 W

DDA

45.8

°C/W

9.2

°C/W

2.3 W

1.31 W

0.98 W

D-14

66.6

°C/W‡

26.9

°C/W‡

1.6 W

0.90 W

0.68 W

PWP

37.5

°C/W

1.4

°C/W

2.8 W

1.60 W

1.20 W

‡ This data was taken using the JEDEC proposed high-K test PCB. For the JEDEC low-K test PCB, the ΘJA is168°C/W for the D−8 package and

122.3

°C/W for the D−14 package.

§ Power rating is determined with a junction temperature of 130°C. This is the point where distortion starts to substantially increase. Thermal

management of the final PCB should strive to keep the junction temperature at or below 125

°C for best performance.

recommended operating conditions

MIN

NOM

MAX

UNIT

Supply voltage, VCC+ to VCC−

Dual supply

±2.5

±7

V

Supply voltage, VCC+ to VCC−

Single supply

+5

+14

V

Operating free-air temperature, TA

C-suffix

0

70

°C

Operating free-air temperature, TA

I-suffix

−40

85

°C